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September 2018

MOS-AK Workshop

September 3, 2018
TU Dresden, Bergstrasse 53 (Von Gerber Building)
Dresden, 01069 Germany
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ESSDERC 2018 - Track 4 "Compact Modelling of Devices and Circuits"

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ICRI 2018

September 12, 2018 - September 14, 2018
HOFBURG Vienna, Heldenplatz
Vienna, Austria
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International Conference for Research Infrastructures 2018

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SiNANO Modelling Summer School

September 25, 2018 - September 28, 2018
Universitat Rovira i Virgili, Campus Catalunya, Av. Catalunya 35
Tarragona, Catalonia Spain
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MULTI-SCALE MODELLING SUMMER SCHOOL Chair: Benjamin Iñiguez (Universitat Rovira i Virgili) Co-Chair: Yvan Bonnassieux (Ecole Politechnique, France) SiNANO Modelling Summer School 2018 (URV) SiNANO Modelling Summer School 2018 (SiNANO)

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November 2018

EFECS 2018

November 20, 2018 - November 22, 2018
Centro de Congressos de Lisboa, Praça Indústrias
Lisbon, PT-1300-307 Portugal
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European Forum for Electronic Components and Systems

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September 2020

ESSCIRC ESSDERC 2020

September 14, 2020 - September 15, 2020
Online

ESSDERC 2020 50th European Solid-State Device Research Conference ESSCIRC 2020 46th European Solid-State Circuits Conference

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November 2020

EFECS 2020

November 25, 2020 - November 26, 2020
Remote

EFECS is the international forum with a focus on ‘Our Digital Future’ along the Electronic Components and Systems value chain in Europe: Learn about funding landscapes & calls for your RD&I projects Shape the ECS Strategic Research and Innovation Agenda Network at the virtual exhibition with the ECS community Pitch in plenary & showcase a poster via ecscollaborationtool.eu

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February 2021

Webinar #1 – Launch

February 2, 2021 @ 2:00 pm - 3:00 pm
Zoom (online), Details will be provided after registration

Launch of Transnational Access

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Webinar #2 – Showroom

February 23, 2021
Zoom (online), Details will be provided after registration

Guided Tour of ASCENT+ Showroom - 13:00 CET (UTC+1)

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Advanced Packaging: Simulation, Technology and Reliability

February 23, 2021
Online (Fraunhofer IPMS), Please register to attend

Advanced Packaging: Simulation, Technology and Reliability - 16:00-16:45 CET (UTC+1)

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March 2021

Webinar #3

March 26, 2021
Zoom (online), Details will be provided after registration

ASCENT+ Offerings: Diamond Technologies - Need some hard stuff? – Diamond growth and technology at Fraunhofer IAF -  Friday 26th March 2021, 14:00 CET (UTC+1)

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