X-Ray Inspection

X-Ray Inspection

Description

X-Ray Inspection

  • Detail recognition: ≥0.5µm
  • Up to 12″ wafer & samples up to 400×400×50 mm
  • Void localisation & 3D-stack inspection

Ascent+ facility
Fraunhofer-IZM

Platform Technologies

  • Advanced Integration

Key Enabling Technologies

  • Metrology / Characterisation: Physical

Additional information

Key Enabling Capability

Metrology / Characterisation

Platform Technology

Advanced Integration, Disruptive Devices, Nano for Quantum Technologies

Facility

Fraunhofer Mikroelektronik