Wafer Direct Bonding

Fraunhofer IZM offers direct bond of 300mm wafers


Fraunhofer IZM offers direct bond services. This includes oxide-oxide bonding as well as hybrid (Oxide-Oxide, Cu-Cu) bonding of 300mm wafers. The service includes in-situ preparation (e.g. cleaning, activation). Upon request, planarization via CMP can also be provided.


  • Wafer size: 300mm
  • Bond type: Oxide-Oxide, Cu-Cu
  • Cleaning: in-situ
  • Activation: in-situ

Ascent+ facility

Platform Technologies

  • Nano for Quantum Technologies
  • Disruptive Devices
  • Advanced Integration

Key Enabling Technologies

  • Processing

Case Study

3D structuring of SiC for vias, membranes, recesses, etc.

Key Enabling Capability


Platform Technology

Advanced Integration, Disruptive Devices, Nano for Quantum Technologies


Fraunhofer Mikroelektronik