Fraunhofer IZM offers direct bond services. This includes oxide-oxide bonding as well as hybrid (Oxide-Oxide, Cu-Cu) bonding of 300mm wafers. The service includes in-situ preparation (e.g. cleaning, activation). Upon request, planarization via CMP can also be provided.
- Wafer size: 300mm
- Bond type: Oxide-Oxide, Cu-Cu
- Cleaning: in-situ
- Activation: in-situ
- Advanced Integration
Key Enabling Capability
3D structuring of SiC for vias, membranes, recesses, etc.