VOC Analysis

VOC Analysis

Analysis of Volatile Organic Compounds (VOC)

Contamination control of air, materials (e.g. glues, plastics) and wafer surfaces. Evaluation of clean room filters, filter materials and analysis equipment. Preparation and characterization of reference samples.


In the field of contamination control we are developing or adapting analytical methods and sample preparation methods to provide emerging solutions for our partners. More Moore as well as More-than-Moore applications are being addressed. With feature sizes shrinking, thinner layers, new materials, 3D integration and more complex designs, contamination control is a constant challenge and a prerequisite for a continuous quality control and achieving high yields in the manufacturing processes.

Our focus is the development of advanced contamination control methods for yield enhancement. Solutions for characterizing wafers, processes, media, materials, and equipment concerning their contamination behaviour, for determining contamination sources, and for certifying cleanroom suitability are being developed together with partners. The characterization methods include the analysis of organic contamination.

For more information: click here

Tools: TD-GCMS, ATD Turbomatrix 650, thermal desorption oven (TDO) for wafers, microchamber


Sample size
  • Cartridge Adsorbents for sampling VOCs, ∅4.8mm, 70mm length
  • Wafer diameter up to 300mm
  • Material, 3×3×50mm
  • Microchamber, for surface emission ∅64mm, for bulk emission up to ∅50mm, and 30mm height
Temperature range
  • Microchamber: Ambient up to 250°C
  • Material: Depends on material (50 up to 300°C)

Ascent+ facility
Fraunhofer IISB

Platform Technologies

  • Advanced Integration

Key Enabling Capability

  • Metrology / Characterisation: Contamination Control

Case Study

Fraunhofer offers analytical capabilities, research and development to partners who do not have their own capabilities.

Additional information

Key Enabling Capability

Metrology / Characterisation

Platform Technology

Advanced Integration


Fraunhofer Mikroelektronik