Description
Multi Target Sputter Cluster
Non Volatile Memory (NVM) Multi Target Sputter Cluster ENDURA by Applied Materials enables multi stack depositions for MRAM, RRAM and FRAM development. Functional materials like Ta(N), Ti(N), Co, CoFe(B)x, Hf(Ox), Ir, Mo, Pt, Ru, W, Zr are used for applications on 300mm wafers.
Ascent+ facility
Fraunhofer IPMS
Platform Technologies
- Nano for Quantum Technologies
- Disruptive Devices
Key Enabling Capability
- Processing: Sputtering
