Sputter Cluster

Multi stack depositions for MRAM, RRAM and FRAM development

Category:

Description

Multi Target Sputter Cluster

Non Volatile Memory (NVM) Multi Target Sputter Cluster ENDURA by Applied Materials enables multi stack depositions for MRAM, RRAM and FRAM development. Functional materials like Ta(N), Ti(N), Co, CoFe(B)x, Hf(Ox), Ir, Mo, Pt, Ru, W, Zr are used for applications on 300mm wafers.

Ascent+ facility
Fraunhofer IPMS-CNT

Platform Technologies

  • Nano for Quantum Technologies
  • Disruptive Devices

Key Enabling Technologies

  • Processing: Sputtering

Additional information

Key Enabling Capability

Processing

Platform Technology

Disruptive Devices, Nano for Quantum Technologies

Facility

Fraunhofer Mikroelektronik