Sputter Cluster

Sputter Cluster

Multi stack depositions for MRAM, RRAM and FRAM development (300mm)



Multi Target Sputter Cluster

Non Volatile Memory (NVM) Multi Target Sputter Cluster ENDURA by Applied Materials enables multi stack depositions for MRAM, RRAM and FRAM development. Functional materials like Ta(N), Ti(N), Co, CoFe(B)x, Hf(Ox), Ir, Mo, Pt, Ru, W, Zr are used for applications on 300mm wafers.

Ascent+ facility
Fraunhofer IPMS

Platform Technologies

  • Nano for Quantum Technologies
  • Disruptive Devices

Key Enabling Capability

  • Processing: Sputtering

Additional information

Key Enabling Capability


Platform Technology

Disruptive Devices, Nano for Quantum Technologies


Fraunhofer Mikroelektronik