Wafer-level Prober

Wafer-level Prober

Versatile wafer prober capable measuring from single dies to 300mm wafers at temperatures between 25°C and 310°C


Wafer-level Electrical Measurement

The Cascade Elite 300M is equipped with 8 manual probes for a maximum flexibility and capable to probe pads down to 25µm size. It has the option to use a probe card with up to 40 contacts. It is connected over a switching matrix to a semiconductor characterization system (Keithley SCS 4200) which is equipped with preamplifiers and a CV measurement option. Additionally an Electrometer (High resistance meter) is available.

The probing Station can handle wafer of any size up to 300mm and even wafers/chips on dicing frame. The chuck can be heated up to 310°C.

CV-Measurement; IV-Measurement; Device characterization


Modules Description Range Resolution
4× 4200-SMU Medium Power Source-Measure Unit ±210 V, ±100 mA 0.2µV, 100 fA
1× 4210-SMU High Power Source-Measure Unit ±210 V, ±1 A 0.2µV, 100 fA
2× 4200-PA Remote Preamplifier 0.2µV, 10 aA
1× 4210-CVU Capacitance-Voltage Unit 1 kHz – 10 MHz ±30 V
4225-PMU Ultra-Fast Pulse I-V Unit ±40 V, ±10V 75 nA

Ascent+ facility

Platform Technologies

  • Nano for Quantum Technologies
  • Disruptive Devices
  • Advanced Integration

Key Enabling Capability

  • Metrology / Characterisation: Electrical

Case Study

Electrical test of wafers or chip arrays.

Additional information

Key Enabling Capability

Metrology / Characterisation

Platform Technology

Advanced Integration, Disruptive Devices, Nano for Quantum Technologies


Fraunhofer Mikroelektronik