Metrology

Metrology Services

Description

Metrology Services

  • Electrical Probing: High-Resistance (0.1 aA), IV, pulsed IV and CV with up to 40 Probes and 310°C
  • Confocal 3D Microscope
  • Profilometer
  • Film stress Measurement using Laser deflection from -40°C to 500°C
  • Film thickness measurement using white light reflectometry

Ascent+ facility
Fraunhofer-IZM

Platform Technologies

  • Nano for Quantum Technologies
  • Disruptive Devices
  • Advanced Integration

Key Enabling Technologies

  • Metrology / Characterisation: Electrical and Mechanical

Additional information

Key Enabling Capability

Metrology / Characterisation

Platform Technology

Advanced Integration, Disruptive Devices, Nano for Quantum Technologies

Facility

Fraunhofer Mikroelektronik