Description
Wafer-level Electrical Measurement
The Cascade Elite 300M is equipped with 8 manual probes for a maximum flexibility and capable to probe pads down to 25µm size. It has the option to use a probe card with up to 40 contacts. It is connected over a switching matrix to a semiconductor characterization system (Keithley SCS 4200) which is equipped with preamplifiers and a CV measurement option. Additionally an Electrometer (High resistance meter) is available.
The probing Station can handle wafer of any size up to 300mm and even wafers/chips on dicing frame. The chuck can be heated up to 310°C.
Keywords
CV-Measurement; IV-Measurement; Device characterization
Specifications
| Modules | Description | Range | Resolution |
|---|---|---|---|
| 4× 4200-SMU | Medium Power Source-Measure Unit | ±210 V, ±100 mA | 0.2µV, 100 fA |
| 1× 4210-SMU | High Power Source-Measure Unit | ±210 V, ±1 A | 0.2µV, 100 fA |
| 2× 4200-PA | Remote Preamplifier | 0.2µV, 10 aA | |
| 1× 4210-CVU | Capacitance-Voltage Unit | 1 kHz – 10 MHz ±30 V | |
| 4225-PMU | Ultra-Fast Pulse I-V Unit | ±40 V, ±10V | 75 nA |
Ascent+ facility
Fraunhofer-IZM
Platform Technologies
- Nano for Quantum Technologies
- Disruptive Devices
- Advanced Integration
Key Enabling Capability
- Metrology / Characterisation: Electrical
Case Study
Electrical test of wafers or chip arrays.
