Diamond substrate preparation: polishing and laser cutting
A Soenen GEM-10 laser diamond-cutting machine is operated at IAF for the production of freestanding diamond films with thicknesses down to 200 µm. The system allows for laser sawing at extremely low breakage rate, single and double sided sawing and mirror smooth cutting of surfaces. In addition, laser shaping can be carried out for customized shapes.
- Single crystalline or heteroepitaxial diamond
Sizes 2.5×2.5mm2 up to 2″
Minimum thickness 150µm
Surface roughness on (001) diamond RA <1nm (up to 8×8mm2)
- Laser Cutting
- Typical sample sizes are up to 4.5×4.5mm2.
- Nano for Quantum Technologies
- Disruptive Devices
- Advanced Integration
Key Enabling Technologies
Polishing and cutting is only accessible in conjunction within a diamond CVD process flow.