CMP

State of the art 300mm Applied Materials CMP tool for dielectric and metal CMP

Category:

300mm Chemical-Mechanical Polishing

Fraunhofer IZM offers processing and consumable evaluation using its state of the art 300mm Applied Materials Reflexion LK CMP tool. The tool is capable of planarizing dielectric and metal layers (patterned and unpatterned) and includes an inline film thickness metrology module.


Specifications

  • Tool type: Applied Materials Reflexion LK
  • Wafer size: 300mm
  • Integrated film thickness metrology module: Nova 3090
  • Multi zone polish heads (contour)
  • Endpoint detection systems (ISRM, WL)
  • Capable of running bonded wafer stacks

Ascent+ facility
Fraunhofer-IZM

Platform Technologies

  • Nano for Quantum Technologies
  • Disruptive Devices
  • Advanced Integration

Key Enabling Technologies

  • Processing

Key Enabling Capability

Processing

Platform Technology

Advanced Integration, Disruptive Devices, Nano for Quantum Technologies

Facility

Fraunhofer Mikroelektronik