Description
300mm Chemical-Mechanical Polishing
Fraunhofer IZM offers processing and consumable evaluation using its state of the art 300mm Applied Materials Reflexion LK CMP tool. The tool is capable of planarizing dielectric and metal layers (patterned and unpatterned) and includes an inline film thickness metrology module.
Specifications
- Tool type: Applied Materials Reflexion LK
- Wafer size: 300mm
- Integrated film thickness metrology module: Nova 3090
- Multi zone polish heads (contour)
- Endpoint detection systems (ISRM, WL)
- Capable of running bonded wafer stacks
Ascent+ facility
Fraunhofer-IZM
Platform Technologies
- Nano for Quantum Technologies
- Disruptive Devices
- Advanced Integration
Key Enabling Capability
- Processing
