3D Advanced Packaging

300mm wafers with advanced packaging options:

  • MicroBump module
  • Cu Pillar module
  • TSV middle module
Category:
µBump module
Enabling samples with bumps of either 20µm pitch or 40µm pitch
Cu pillar module
Enabling Cu pillars at 100µm pitch with target height of 50µm of Cu
TSV middle module
With 5×50 Cu filled TSVs

Specifications

µBump module
Rule
Description
Value [µm]
top bottom
Bump pitch 40, 20
Bump diameter 7.5 12.5
Bump material Cu/Ni/Sn Cu
Material Thickness 5/1/3.5 5
Cu Pillar module
Rule
Description
Value [µm]
Pillar pitch 100
Pillar diameter ∅ 50
Pillar material Cu
Material Thickness 50
TSV module
Rule
Description
Value [µm]
TSV diameter 5
TSV depth 50
TSV fill material Cu
TSV barrier material TaNTa
TSV seed material Cu

Ascent+ facility
imec

Platform Technologies

  • Advanced Integration

Key Enabling Technologies

  • Processing

Case Study

Access to the specific modules to enable users to characterise their designs related to the individual module. Can enable electrical, morphological or failure analysis of specific concepts.

Basic processing of a limited number of steps, including in-line metrology allowing further work to be done on the wafers by the user.

Key Enabling Capability

Processing

Platform Technology

Advanced Integration

Facility

imec