Tyndall National Institute

Established with a mission to support industry and academia in driving research to market, Tyndall National Institute is one of Europe’s leading research centres in Information and Communications Technology (ICT) research and development and the largest facility of its type in Ireland. Established in 2004 as a successor to the National Microelectronics Research Centre (NMRC founded in 1982) at University College Cork, the Institute employs over 460 researchers, engineers and support staff, with a full-time graduate cohort of 135 students generating over 200 peer-reviewed publications each year.

With a network of 200 industry partners and customers worldwide, Tyndall generates around €30M income each year, 85% from competitively won contracts nationally and internationally. Tyndall is also a lead partner in European research partnerships in its core areas of ICT, communications, energy, health and the environment worth €44M, including €6M accruing to industry in Ireland (from Framework 7). Hosting the only full CMOS (metal oxide semiconductor) integrated circuit construction, Micro Electronic Mechanical systems (MEMS) and III-V Wafer Semiconductor fabrication facilities and services in Ireland, Tyndall is capable of prototyping new product opportunities for its target industries – electronics, medical devices, energy and communication. Tyndall is a globally leading Institute in its four core research areas of Photonics, Microsystems, Micro/Nanoelectronics and Theory, Modeling and Design. Tyndall is the lead institution for the Science Foundation Ireland funded Irish Photonics Integration Centre (IPIC).

For more information go to Tyndall Website

Access Offerings

Flexilab – Cleanroom access for novel materials
  • Integration of new materials, device and subsystem concepts
  • Device characterisation facilities
Technologies to define nanowire structures and arrays
  • e-beam for nanowire patterning (sub 10nm)
  • Focussed ion beam (FIB) milling (for customisation of nanowire structures at dimensions below 10nm, potentially 2.5nm)
  • Technologies for 2D contacting to nano-scale structures
  • e-beam contacting on flakes (e.g. graphene) or transition metal di-chalcogenides (TMD)
  • Metal contact tracks enabled using e-beam or FIB