White Paper

ASCENT White Paper

An Exploration of Contamination Types and Contamination Control Techniques Currently used in the Fabrication of Nanoelectronics

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Table of Contents

• 1 – Types of Contamination
  • 1.1 – Particles – Organic/Inorganic
  • 1.2 – Metals
  • 1.3 – Airborne Molecular Contamination – AMC
• 2 – Baseline Contamination Levels
  • 2.1 – Front End Processes (ITRS 2013)
  • 2.2 – Contamination limits for Image Sensors
  • 2.3 – Metallic contamination of UPW
  • 2.4 – Organic contamination of UPW
  • 2.5 – Particle contamination of UPW
  • 2.6 – Liquid Chemicals, Bulk and Specialty Gases
  • 2.7 – Cleanroom and AMC
• 3 – Contamination Control
  • 3.1 – Detection of Material on a Wafer Surfaces
    • 3.1.1 – TXRF & III-V Materials
  • 3.2 – Detection of Electrical Active Defects in Wafers and Devices
    • 3.2.1 – On Wafer Surfaces
    • 3.2.2 – Electrical Test Structures
• 4 – Control Techniques and Strategies
  • 4.1 – Wafer Cleaning
  • 4.2 – Material Assessment
  • 4.3 – Protocols
  • 4.4 – Wafer Processing
• 5 – Detection & Analysis Techniques
  • 5.1 – TXRF (Total X-ray Fluorescence)
  • 5.2 – ICP-MS (Inductively Coupled Plasma Mass Spectrometry)
  • 5.3 – SIMS/D-SIMS/TOF-SIMS (Secondary Ion Mass Spectrometry)
  • 5.4 – SPV (Surface PhotoVoltage)
  • 5.5 – µPCD (Microwave Photoconductive Decay)
  • 5.6 – DLTS (Deep Level Transient Spectroscopy)
  • 5.7 – Detection Limits
• 6 – Aspects for Scaling
  • 6.1 – Contamination/Quality Control
  • 6.2 – Continued Scaling
  • 6.3 – Future Considerations
• Glossary
• Bibliography