Tyndall National Institute is Ireland’s largest ICT research institute (>460 researchers) with research priorities in the areas of Micro/Nanoelectronics and Photonics. Tyndall activities enable major Deep Tech innovation in Digital and Production Key Enabling Technologies (KETs). Tyndall’s key infrastructure includes:
- Design, Modelling & Simulation
- Semiconductor Material Growth
- Device Fabrication (Silicon and III-V)
- Characterisation (Electrical, Physical, Optical, Mechanical, …)
- Photonic & Electronic Packaging
Through ASCENT+ Tyndall provides access to Key Enabling Capabilities in Nano for QuTech, Disruptive Devices and Advanced Integration, as described below.
Nano for Quantum Technologies
Tyndall has uniquely developed site-controlled III-V quantum dots for quantum light emission, e.g. single photons, and has demonstrated the only site-controlled quantum dot system capable of high fidelity entangled light emission.
Tyndall offers access to:
- Site-controlled single/multiple quantum dots and devices
- Re-growth GaAs processing
- Epitaxial growth of AlGaAs- and GaAs-based structures
- Post-growth processing for device fabrication
- Single-dot optical emission
- Preparation for transfer printing of structures
- Modelling of quantum nanostructures
- Based on group IV, group-III and group-V materials and their alloys. To assist in the evaluation/control of interactions between spins, photons and phonons. Tyndall has experience calculating the effects of intrinsic defects in group IV semiconductor nanostrucures on the band structure, oscillatorstrengths, spin and transport properties. These are currently being studied for single photon sources for quantum cryptography.
- Dry cryogenic time-resolved microPL and cryogenic workstation with optical access
- Correlation spectroscopy and quantum tomography of polarization states
- Optical quasi-resonant and resonant excitation of nanostructures (650-950nm)
- Devices/Test Structures
- Site-controlled single and entangled photon emitters in the near infrared and matched to atomic vapour quantum memories
- Tyndall’s Central Fabrication Facilities consists of three distinct cleanroom spaces, 250m2 of class 1,000 and class 10 for flexible silicon fabrication, 750m2 of class 10,000 and class 100 for MEMS/NEMS and compound semiconductor fabrication, and 40 m2 of class 1000 for e-beam lithography.
Tyndall offers processing access to:
- Tunnelling devices, sensors & NEMS.
- Processing protocols and flexibility to take advanced materials from users and integrate them into working electronic devices.
- Advanced Patterning: E-beam lithography is available for nanowire patterning on Si or non-Si substrates. Sub-10 nm wide wires can be fabricated to provide test structures for nanowire process development analysis, as well as for electrical characterisation of structures with fine features.
- Metal customisation: Metal contact tracks enabled using the electron beam or FIB (Focused ion beam) milling – allows customization of nanowire structures at dimensions of 10nm and lower (potentially 2.5nm)
- 2D contacting: Technologies for 2D contacting to nanoscale structures and e-beam contacting on flakes (graphene, transition metal dichalcogenides, etc.). Electrical characterization can be undertaken for resistance measurements, or if required demonstrator FET devices can be fabricated by this method of e-beam lithography and contacting.
- Atomistic calculation of the physical parameters that determine optical, electronic transport and thermoelectric properties of materials for novel devices. Tyndall provides modelling access to the determination from first-principles of:
- Effects of strain, doping and alloying on the electronic and thermoelectric of group IV materials, including electron-phonon, impurity and alloy scattering.
- Band offsets between group IV, group-III and group-V materials, and their dependence on strain and anion/cation interface termination.
- Deformation potentials as a function of strain and alloy composition for group-IV compounds and Si nanowires.
- Optical matrix elements between electronic bands in group-IV and group III-V alloys, and superlattices. This includes optical coupling between indirect bands via electron-phonon, impurity and alloy scattering
- Electron and phonon non-equilibrium dynamics, for instance after photoexcitation, in Ge and Bi
- Effects of alloying and strain on phonon band structures.
- Tyndall has extensive expertise in Metrology/Characterisation for the development of Disruptive Devices, in particular in defects metrology at the dielectric/semiconductor interface of various materials systems; including Si, Ge, III-V, Transition Metal Dichalcogenides (TMDs) and SiC for different applications:
- Multi-frequency impedance measurements taken at a range of temperatures (77K-450K)
- Physical characterisation using a variety of techniques
- Nanovisualisation with AFM, DBFIB
- High Resolution TEM, SEM and FIB, EDAX capability
- Raman & Optical Spectroscopy
- Fluorescence microscopy
- Scanning Acoustic microscope
- Nanoferroics characterisation of magnetoelectric multiferroic materials, including
- Magnetic force microscopy (MFM) imaging under a high, variable magnetic field
- Simultaneous MFM and PFM under high tip-sample voltage bias and high, variable magnetic field.
- The Tyndall Flexifab allows the integration of new materials, device and subsystem concepts, from the nano- to the meso-scale, thereby, enabling research across nanoelectronics, nanophotonics and nanobiotechnology. In particular, integrating photonics with nanoelectronics can achieve the functionality of heterogeneous multi-chip integrations solutions but with the performance, complexity and scalability of ‘systems on a chip’. There are a number of developed processes that are proven to produce state-of-the-art results to be used in the monolithic integration of nanophotonics and optical sensors with advanced CMOS.
- Unique suite of computational tools to accurately describe electronic and thermal transport properties of bulk semiconducting materials to identify materials with tailored electro-thermal properties for heat dissipation. Numerical modelling software for advancing the integration of photonic technologies (e.g. LUMERICAL suite and Photodesign FIMMWAVE/FIMMPROP).