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Advances and Access to
Planar FDSOI and Nanowire Devices

Material for Device Analysis

Material for Circuit Performance Analysis

Electrical Characterisation Capabilities

Physical Characterisation Capabilities


Material for Device Analysis

  • 300mm wafers with planar FDSOI and Nanowire devices
  • SPICE models and model cards for digital: target and preliminary
    • 14nm FDSOI
    • 10nm FDSOI
    • 10nm FFSOI
  • TCAD decks
    • FDSOI MOSFET
    • Trigate SOI Nanowire
    • GAA Nanowire MOSFET (mainly electrostatics)
  • To come in the near future:
    • Spice model for Stacked NWs (7nm tech. node)


Material for Circuit Performance Analysis

  • Preliminary PDK for Full custom IC design
    • 14nm planar FDSOI technology
    • 10nm planar FDSOI technology (preliminary)
  • DK for IC demonstrators
    • 28nm FDSOI technology (ST Microelectronics)
  • Near future:
    • PDK 10nm including libraries


PDK: Indicative Leti Roadmap

Node 14nm 10nm 7nm
2D/3D Planar Coolcube Planar Coolcube Planar
M1 pitch 64nm 64nm 44nm 44nm 32nm
DRM End Q4’15 Q1’16
DRC End Q4’15 Q1’16
FDSOI SPICE models None
FinFET SPICE models End Q4’15 End Q4’15 Q3’16
Stacked-NW SPICE models Q3’16
LVS Q1’16 Q3’16
PEX Q1’16 Q3’16
Std cell libs X X Q1’16 Q3’16 Q1’17


Electrical Characterisation Capabilities

Available systems and methods

  • Parametric testers with 300mm full auto probers
  • Probe cards and new membrane cards
  • Statistical data treatment
  • Functional tests
  • General purpose I(V)-C(V) 200/300mm testers
  • Temperature range for test on wafers: 2K ⇒ 600°C
  • Test systems for memories
  • HF tests up to 40 MHz
  • Noise measurements
  • Reliability tests: hot carriers, TDDB, charge pumping, …
  • Internal Photo Emission
  • Emission microscopy (visible & infrared)
  • Electrical test under calibrated strain
  • High power tests (10kV, >100A) on 300mm prober
  • Deep Level Transient Spectroscopy
  • Electrostatic discharges
  • Electromigration
  • Oven and climatic environments


Physical Characterisation Capabilities

Available systems and methods

  • Atomic Force Microscopy
    – Dimension AFM Icon/Fast Scan Bruker working under glovebox (O2, H2O <1 ppm)
  • High Resolution Transmission Electron Microscopy
    – FEI TECNAI G2 F 20
    – FEI TITAN THEMIS 80-200 kV
  • ToF-SIMS
    – ION TOF ToF SIMS 5
  • Atom Probe Tomography
    – CAMECA FlexTAP Atom probe
  • XRD (X-ray Diffraction)
    – Diffractometer – Smartlab RIGAKU – 5 circles
  • XPS (X-ray Photoelectron Spectroscopy)
    – Spectrometer/microscope – PHI VERSA PROBE II
  • Ellipsometer
    – Ultraviolet-visible ellipsometer – HORIBA JOBIN YVON UVISEL