Ascent

Ascent

European Nanoelectronics Network

New Offering

ASCENT is now offering access to micro-bumps and Cu pillars for 3D integration.

For more information, visit imec µ-bump offer

imec is now able to offer semi-additive µ-Bumping or Cu pillar processing for users with previously processed Si CMOS or MEMS wafers.

Additionally we can offer short loop µ-Bump or Cu pillar wafer preparation for specific characterisation activities (e.g. metrology development, Failure Analysis understanding, etc.).

Larger integration projects may be considered on a case by case basis.


ASCENT Provides

  • Fast and easy access to the world’s most advanced CMOS technologies and infrastructure.

  • Access to 14nm CMOS device data, nanoscale test chips and characterisation facilities in Tyndall National Institute (Ireland), CEA-Leti (France) and imec (Belgium).

  • Access open to all researchers in universities, research centres, SMEs and industry.

  • Opportunity to share best scientific and technological practices, form a knowledge–innovation hub, train new researchers and establish a nanoelectronics research network.

  • Interface to global industrial leaders in nanoelectronics.


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10th ASCENT Newsletter – July 2018

New Offer: imec 3D Packaging

imec has extended its ASCENT offer to include semi-additive µ-Bumping or Cu pillar processing for researchers with previously processed Si CMOS or MEMS wafers.

Additionally they can offer short loop µ-Bump or Cu pillar wafer preparation for specific characterization activities (e.g. metrology development, Failure Analysis understanding etc). Larger integration projects may be considered on a case by case basis.

Please don’t hesitate to send me any questions relating to this new offer or indeed any queries about the ASCENT programme – paul.roseingrave @ tyndall.ie

 


See you @ IEEE Nano 2018 – Cork, Ireland

The IEEE International Conference on Nanotechnology hosts the 18th Conference in Cork, Ireland from 24th to 26th July 2018 and ASCENT will also be there. This is an ideal opportunity to meet with and discuss the ASCENT offer.

Visit Tyndall: We can also arrange for you to visit Tyndall to get a better understanding of the research facilities available thought this EU funded programme.

This conference attracts both academic and industry based researchers which also offers tutorials / meetings on Monday 23rd July.

The conference scope spans nanoscience and nanotechnology, from fundamentals in nanomaterials, nanofabrication and nano-characterisation to development of nanosensors, nanoactuators and nanoelectronic or nanophotonic devices.

A special invited industry session will take place on Thursday 24th July entitled Opportunities and Challenges for Nano-Enabled Smart Things.

More information and registration: ieeenano18.org

To arrange a meeting with an ASCENT representative or a visit to Tyndall please contact Paul (ASCENT Access Co-ordinator) paul.roseingrave @ tyndall.ie

 


Time running out – Limited access days remain

The ASCENT infrastructure access programme is now running three and a half years providing either direct, remote or virtual access to the world’s most advanced CMOS technologies and infrastructure.

The programme is closing in 10 months time and only limited access days remain so we are reminding all nanoelectronic researchers to apply now … before it is too late.

This programme has been designed for easy access, including rapid response to enquiries, short proposal templates and swift review turnaround times. Also the access provided to three top Nanoelectronics Researcher Institutes across Europe – imec, CEA Leti & Tyndall National Institute – is free of charge to you – once you commit to publishing your results.

For any enquiries, email Paul (ASCENT Access Co-ordinator): paul.roseingrave @ tyndall.ie

 


ASCENT Statistics

ASCENT launched in November 2015 and since then has attracted a network of over 350 members, who have submitted 142 enquiries resulting in 73 Virtual and Transnational researchers accessing ASCENT facilities …

 


ESSDERC/ESSCIRC 2018
MOS-AK / ASCENT Workshop

This Conference will take place in Dresden, Germany from Monday 3rd to Thursday 6th September 2018.

ASCENT will once again attend and be available for meeting/discussions to all attendees to outline how this Infrastructure Access project works and what benefits it can offer to researchers, from both academia and industry.

Conference information: www.esscirc-essderc2018.org

MOS-AK / ASCENT Workshop

ASCENT will, in conjunction with MOS-AK, host a Workshop on Monday 3rd September. The specific workshop goal will be to classify the most important directions for the future development of the electron device models, not limiting the discussion to compact models, but including physical, analytical and numerical models, to clearly identify areas that need further research and possible contact points between the different modelling domains.

Workshop information: www.mos-ak.org/dresden_2018


Previous Issues:

Apr 2018 / Jan 2018 / Oct 2017 / Jul 2017 / Apr 2017 / Jan 2017 / Sep 2016 / Jun 2016 / Feb 2016


This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 654384.

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This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 654384.